What is BGA in packaging?
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
What is BGA in manufacturing?
Ball Grid Array (BGA) Production. SMD ball grid array (BGA packages) enable high density connections to be made more easily to integrated circuits by allowing the under-side of a chip package to be used for the connectivity.
What is BGA in SMT?
Ball grid array (BGA) is a type of surface mount technology (SMT) that is used for packaging integrated circuits. BGA is made up of many overlapping layers that can contain one to a million multiplexers, logic gates, flip-flops or other circuits.
What is a plastic BGA?
BGA, short for ball grid array, contains arrays of tin balls arranged in grid and its solder balls play a role as connection interface between packaging ICs and PCBs. Their connection is acquired through the application of SMT (surface mount technology).
What is the BGA balls made of?
In BGA packages, instead of a lead frame, an organic substrate is used. The substrate is generally made of bismaleimide triazine or polyimide. The chip is mounted to the top of the substrate, and solder balls constructed on the bottom of the substrate make connections to the circuit board.
Does BGA need solder paste?
In most cases BGA rework can be achieved, and is often more reliable, without addition of solder paste (i.e., using only the solder balls). This assumes a good site prep and proper flux process. In cases where there may be planarity issues, solder paste can be beneficial.
Is LGA or PGA better?
In my personal opinion, LGA based CPUs are superior to PGA. A damage to pins on a CPU can be more expensive than damage to the pins on a motherboard. A CPUs is often twice, if not multiple times, as expensive as the motherboard. I would rather have less durable motherboard than a less durable CPU.
How do you solder a BGA package?
BGA Soldering by Hand
- Apply Flux Paste (Not Liquid Flux) on to the pad.
- Place solder balls very carefully on the pad.
- Apply paste flux to the bottom (soldering side) of the BGA package.
- Carefully place the BGA Package on the solder balls.
- Preheat and then apply Hot Air with Hot Air Blower from both top and bottom.
Can you solder BGA by hand?
BGA Soldering by Hand Apply Flux Paste (Not Liquid Flux) on to the pad. Paste flux will help solder balls to stick so that they do not fall or change position. Place solder balls very carefully on the pad. Apply paste flux to the bottom (soldering side) of the BGA package.
What is tacky flux?
Tacky fluxes are commonly used in the electronics assembly industry for a variety of applications. These fluxes generally have honey-like consistency and can be used for ball attach applications, BGA re-balling and hand soldering applications.
How is BGA used in the packaging process?
As an advanced packaging technology, BGA features large lead space and short leads through distributing I/O ends that perform as balls or columns at the bottom of package body.
How are the pins arranged in the BGA?
The pins are in the form of solder balls that are arranged in a grid like pattern on the undersurface of the package to increase the area used for the connections rather than just the periphery. BGA has evolved from the PGA package.
What kind of packaging is a ball grid array?
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
How does a wireboned BGA package work?
A wireboned BGA package uses wires to connect the silicon die to the substrate. A flipchiped package utilizes bumps as shown in the following figure.