How does sputtering deposition work?
Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. The ions strike the target and atoms are ejected (or sputtered) from the surface. These collisions cause an electrostatic repulsion which ‘knock off’ electrons from the sputtering gas atoms, causing ionization.
What is the process of sputtering?
Sputtering is a physical process in which atoms in a solid-state (target) are released and pass into the gas phase by bombardment with energetic ions (mainly noble gas ions). Sputtering is usually understood as the sputter deposition, a high vacuum-based coating technique belonging to the group of PVD processes.
How are materials sputtered?
In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs naturally in outer space, and can be an unwelcome source of wear in precision components.
What is sputtered on the whole wafer?
Explanation: Aluminium is sputtered on the whole wafer before removing the excess metal from the wafer.
What is magnetron in sputtering?
Magnetron sputtering is a high-rate vacuum coating technique that allows the deposition of many types of materials, including metals and ceramics, onto as many types of substrate materials by the use of a specially formed magnetic field applied to a diode sputtering target.
What is purpose of sputtering?
Sputtering is a Physical Vapor Deposition vacuum process used to deposit very thin films onto a substrate for a wide variety of commercial and scientific purposes. Sputtering occurs when an ionized gas molecule is used to displace atoms of a specific material.
What is RF magnetron sputtering?
RF magnetron sputtering is a technique where Argon ions are accelerated by a RF electric field to hit a target made of the material to sputter. When a magnetic field is used to fold the ions and electrons trajectories, mean free path is increased and sputtering yield is increased.
What are sputtering targets?
A sputtering target is a material that is used to create thin films in a technique known as sputter deposition, or thin film deposition. As a result, most sputtering target materials are metallic elements or alloys, although there are some ceramic targets available that create hardened thin coatings for various tools.
What is PVD sputtering?
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a “target” that is a source onto a “substrate” such as a silicon wafer. The sputtering gas is often an inert gas such as argon.
What is a sputter coater?
Sputter coating is a physical vapor deposition process used to apply a very thin, functional coating on a substrate. The process starts by electrically charging a sputtering cathode which in turn forms a plasma causing material to be ejected from the target surface.
What is sputter Slideshare?
Sputtering steps Ions are generated and directed at a target. The ions sputter targets atoms. The ejected atoms are transported to the substrate. Atoms condense and form a thin film.